In the 5g era, the trend of high power, high integration and high heat is obvious. The heat dissipation of high-power devices has become the "hard demand" of consumer electronic products.

Due to its advantages in heat dissipation efficiency, the temperature equalizing plate (VC) has gradually become the mainstream heat dissipation solution for 5g mobile phone computers, and has accelerated the development towards ultra-thin, simple structure and low cost. The technical iteration is accelerating. In the future, with the further expansion of 5g terminal server products, the market growth potential of VC equalizer is huge.